I am completely new to ANSY and have been struggling for some time trying to get the hang of things.
I am deliberating between using ANSYS AIM and ANSYS Workbench to simulate stress associated with current density and Joule Heating in solder balls incorporated in chip packaging, which undergo electromigration. I have been able to bring my 3-D model into both interfaces from SolidWorks, defined materials and set boundary conditions with current inputs, temperature conditions, etc.; however, ANSYS Workbench is limited due to the size of my model (it has 98 bodies) and the features it offers (I have not found a way to set the boundary conditions for convection heat). Meanwhile, ANSYS AIM has had few problems the size of my model besides the amount of memory/CPU/disk space used, and offers all of the boundary conditions that I need to include. ANSYS AIM so far has been more appealing due to its intuitive interface; however it has given me a series of errors and warnings, which I have tried to correct, some alerting me to confirm the coefficient of expansion of a material, stating that there was an abrupt change for contact or that the material has inverted on itself. After checking with multiple literature sources, I have confirmed that the coefficient of thermal expansion that I have entered for one of my materials is correct.
I am back to the drawing board to determine which is actually better for running this sort of simulation, and after speaking with some professionals on the phone, I am considering using APDL, but have no idea where to start in this regard, as I only have experience coding in MATLAB, but am rusty. If anyone has experience in this area, any advice is greatly appreciated!
Thank you for your time.