I'm studying Si die/chip warpage and forces required to flatten them (Image of the schematic is attached). The dimensions of the die are 10,000 um length, 6000 um width and 300-700 um thickness. The die warpage is 0.1-1 um.
When I sketch such geometry in DesignModeler and try to extrude it along the width, I get:
Error: No profiles could be swept along the selected direction vector
Context: Extrude Feature Extrude2
How can I fix this?