I'm using ANSYS APDL.
I want to do analysis about a time varying temperature loading thermal-mechanical analysis.
Generally, coupled thermal-structural analysis is used for it.
Firstly, thermal analysis is completed and then, followed by structural analysis.
I have interested in thermal analysis as below.
1. A PCB strip is pre-heated in 220'C bake.
2. The PCB is cooled down to 25'C
3. The PCB is re-heated to 260'C
But, I want to use nodal temperature not heat flux as loading, in the menu path 'solution>Define load> apply>temperature' load temperature.
and I want that temperature distribution is even because it is steady state, (just it is different by time not location).
How can I make the solution.