I'm using ANSYS APDL.

I want to do analysis about a time varying temperature loading thermal-mechanical analysis.

Generally,  coupled thermal-structural analysis is used for it.

Firstly, thermal analysis is completed and then, followed by structural analysis.

I have interested in thermal analysis as below.

1. A PCB strip is pre-heated in 220'C bake.

2. The PCB is cooled down to 25'C

3. The PCB is re-heated to 260'C

But, I want to use nodal temperature not heat flux as loading, in the menu path  'solution>Define load> apply>temperature' load temperature.

and I want that temperature distribution is even because it is steady state, (just it is different by time not location).

How can I make the solution.